Emitting Color: | Warm White,Natural White,Cool White | Chip Material: | Bridgelux |
---|---|---|---|
Type: | COB LED | Application: | COB LED Grow Lamp,led Flood |
Product Name: | Flexible Flip Chip Cob Led | Power: | 20W 30W |
Highlight: | 30W Flip Chip Cob Led,Bridgelux Flip Chip Cob Led,Flexible Flip Chip Cob Led |
20W 30W Flip chips alumnium no goldwire international brand
• Compact high flux density light source
• Uniform, high quality illumination
• Minimum 70, 80, and 90 CRI options
• StreaCLined thermal path
• ENERGY STAR® / ANSI compliant color binning
structure with 2, 3 and 5 SDCM standard
Chip LED Cob Product advantages:
1. Good thermal performance and wide hot channel.
2. The spot is uniform.
3. Energy saving and environmental protection, high light efficiency.
4. High brightness, low light decay, polished.
5. Easy to use and easy to install.
6. Strong antistatic ability.
Application Of COB LED
1,mining lamp
2,floodlight
3,project light lamp
4,tunnel light
5,LED downlight
Part Number | Typical Power (W) | Nominal CCT (K) | Minimum Pulsed Flux (lm) | Typical Pulsed Flux (lm) | Typical Voltage (V) | Nominal Current (mA) | Typical Efficacy (lm/W) |
ML13070302P530E*7 | 3.1 | 3000 K | 377 | 419 | 9.6 | 320 | 135 |
ML13070302P535E*7 | 3.1 | 3500 K | 382 | 425 | 9.6 | 320 | 137 |
ML13070302P540E*7 | 3.1 | 4000 K | 385 | 428 | 9.6 | 320 | 138 |
ML13070302P550E*7 | 3.1 | 5000 K | 388 | 431 | 9.6 | 320 | 139 |
ML13070302P557E*7 | 3.1 | 5700 K | 391 | 434 | 9.6 | 320 | 140 |
ML13070302P565E*7 | 3.1 | 6500 K | 388 | 431 | 9.6 | 320 | 139 |
ML13070302P522E*8 | 3.1 | 2200 K | 304 | 338 | 9.6 | 320 | 109 |
ML13070302P527E*8 | 3.1 | 2700 K | 326 | 363 | 9.6 | 320 | 117 |
ML13070302P530E*8 | 3.1 | 3000 K | 338 | 375 | 9.6 | 320 | 121 |
ML13070302P535E*8 | 3.1 | 3500 K | 346 | 384 | 9.6 | 320 | 124 |
ML13070302P540E*8 | 3.1 | 4000 K | 352 | 391 | 9.6 | 320 | 126 |
ML13070302P550E*8 | 3.1 | 5000 K | 357 | 397 | 9.6 | 320 | 128 |
ML13070302P557E*8 | 3.1 | 5700 K | 363 | 403 | 9.6 | 320 | 130 |
ML13070302P565E*8 | 3.1 | 6500 K | 357 | 397 | 9.6 | 320 | 128 |
ML13070302P522E*9 | 3.1 | 2200 K | 262 | 291 | 9.6 | 320 | 94 |
ML13070302P527E*9 | 3.1 | 2700 K | 285 | 316 | 9.6 | 320 | 102 |
ML13070302P530E*9 | 3.1 | 3000 K | 296 | 329 | 9.6 | 320 | 106 |
ML13070302P535E*9 | 3.1 | 3500 K | 304 | 338 | 9.6 | 320 | 109 |
ML13070302P540E*9 | 3.1 | 4000 K | 310 | 344 | 9.6 | 320 | 111 |
ML13070302P550E*9 | 3.1 | 5000 K | 315 | 350 | 9.6 | 320 | 113 |
ML13070302P557E*9 | 3.1 | 5700 K | 321 | 357 | 9.6 | 320 | 115 |
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
Nominal CCT |
Center Point | MAJOR AXIS (a , b) |
Ellipse
Rotation Angel,θ |
|||
X | Y | 2-Step | 3-Step | 5-Step | ||
2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
6.1 Table 39: Maximum Ratings
Notes for Table 39:
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL
Product Packing and Labeling