Emitting Color: | Warm White,Natural White,Cool White | Chip Material: | Bridgelux |
---|---|---|---|
Type: | COB LED | Application: | COB LED Grow Lamp |
Product Name: | Flexible Cob Chip | Warranty: | 5 Years |
Highlight: | Compact Flip Chip Cob Led,ANSI Flip Chip Cob Led,80CRI Bridgelux Led Chip |
20W 30W big luminous area residencial flip chip indoor downlights
• Efficacy of 128 lm/W typical for 3000K, 80CRI
• Compact high flux density light source
• Uniform, high quality illumination
• Minimum 70, 80, and 90 CRI options
• StreaCLined thermal path
• ENERGY STAR® / ANSI compliant color binning structure with 2, 3 and 5 SDCM standard
• More energy efficient than incandescent, halogen and fluorescent lamps
• High voltage or Low voltage DC operation
• Product series and company logo on the front
• RoHS compliant
2, Product Nomenclature
The part number designation for TYF ML Series LED arrays is explained as follows:
Part Number | Typical Power (W) | Nominal CCT (K) | Minimum Pulsed Flux (lm) | Typical Pulsed Flux (lm) | Typical Voltage (V) | Nominal Current (mA) | Typical Efficacy (lm/W) |
ML13070302P530E*7 | 3.1 | 3000 K | 377 | 419 | 9.6 | 320 | 135 |
ML13070302P535E*7 | 3.1 | 3500 K | 382 | 425 | 9.6 | 320 | 137 |
ML13070302P540E*7 | 3.1 | 4000 K | 385 | 428 | 9.6 | 320 | 138 |
ML13070302P550E*7 | 3.1 | 5000 K | 388 | 431 | 9.6 | 320 | 139 |
ML13070302P557E*7 | 3.1 | 5700 K | 391 | 434 | 9.6 | 320 | 140 |
ML13070302P565E*7 | 3.1 | 6500 K | 388 | 431 | 9.6 | 320 | 139 |
ML13070302P522E*8 | 3.1 | 2200 K | 304 | 338 | 9.6 | 320 | 109 |
ML13070302P527E*8 | 3.1 | 2700 K | 326 | 363 | 9.6 | 320 | 117 |
ML13070302P530E*8 | 3.1 | 3000 K | 338 | 375 | 9.6 | 320 | 121 |
ML13070302P535E*8 | 3.1 | 3500 K | 346 | 384 | 9.6 | 320 | 124 |
ML13070302P540E*8 | 3.1 | 4000 K | 352 | 391 | 9.6 | 320 | 126 |
ML13070302P550E*8 | 3.1 | 5000 K | 357 | 397 | 9.6 | 320 | 128 |
ML13070302P557E*8 | 3.1 | 5700 K | 363 | 403 | 9.6 | 320 | 130 |
ML13070302P565E*8 | 3.1 | 6500 K | 357 | 397 | 9.6 | 320 | 128 |
ML13070302P522E*9 | 3.1 | 2200 K | 262 | 291 | 9.6 | 320 | 94 |
ML13070302P527E*9 | 3.1 | 2700 K | 285 | 316 | 9.6 | 320 | 102 |
ML13070302P530E*9 | 3.1 | 3000 K | 296 | 329 | 9.6 | 320 | 106 |
ML13070302P535E*9 | 3.1 | 3500 K | 304 | 338 | 9.6 | 320 | 109 |
ML13070302P540E*9 | 3.1 | 4000 K | 310 | 344 | 9.6 | 320 | 111 |
ML13070302P550E*9 | 3.1 | 5000 K | 315 | 350 | 9.6 | 320 | 113 |
ML13070302P557E*9 | 3.1 | 5700 K | 321 | 357 | 9.6 | 320 | 115 |
4, Applications:
5. Optical properties
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
Nominal CCT |
Center Point | MAJOR AXIS (a , b) |
Ellipse
Rotation Angel,θ |
|||
X | Y | 2-Step | 3-Step | 5-Step | ||
2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
6, Absolute Maximum Ratings
6.1 Table 39: Maximum Ratings
Notes for Table 39:
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
8, CAUTION
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL
9, Packaging and Labeling
Product Packing and Labeling