Power: | 30w | Emitting Color: | Warm White,Natural White,Cool White |
---|---|---|---|
Chip Material: | Bridgelux | Type: | COB LED |
Application: | LED Grow Lamp | Product Name: | Chip LED Cob |
Highlight: | 20w Chip LED Cob,High CRI Chip LED Cob,30w LED Cob chip |
20w 30w High CRI Chip LED Cob Low Heating Generation For Led Flash Light
Feature:
• The product has a typical efficacy of 128 lm/W for 3000K, 80 CRI.
• It has a compact high flux density light source.
• The product offers uniform and high-quality illumination.
• Minimum 70, 80, and 90 CRI options are available.
• It has a streamlined thermal path.
• The product is ENERGY STAR® / ANSI compliant with color binning structure with 2, 3, and 5 SDCM standard.
• It is more energy efficient than incandescent, halogen, and fluorescent lamps.
• The product can operate on either high voltage or low voltage DC.
• The product series and company logo are on the front.
• The product is RoHS compliant.
The part number designation for TYF ML Series LED arrays is explained as follows:
Part Number |
Typical Power (W) | Nominal CCT (K) |
CRI |
Minimum Pulsed Flux (lm) | Typical Pulsed Flux (lm) | Typical Voltage (V) | Nominal Current (mA) | Typical Efficacy (lm/W) |
CL25171210P430E*7 | 30.6 | 3000 K | 70 | 4468 | 4804 | 34 | 900 | 157 |
CL25171210P435E*7 | 30.6 | 3500 K | 70 | 4553 | 4896 | 34 | 900 | 160 |
CL25171210P440E*7 | 30.6 | 4000 K | 70 | 4639 | 4988 | 34 | 900 | 163 |
CL25171210P450E*7 | 30.6 | 5000 K | 70 | 4696 | 5049 | 34 | 900 | 165 |
CL25171210P457E*7 | 30.6 | 5700 K | 70 | 4724 | 5080 | 34 | 900 | 166 |
CL25171210P465E*7 | 30.6 | 6500 K | 70 | 4696 | 5049 | 34 | 900 | 165 |
CL25171210P422E*8 | 30.6 | 2200 K | 80 | 3785 | 4070 | 34 | 900 | 133 |
CL25171210P427E*8 | 30.6 | 2700 K | 80 | 4013 | 4315 | 34 | 900 | 141 |
CL25171210P430E*8 | 30.6 | 3000 K | 80 | 4183 | 4498 | 34 | 900 | 147 |
CL25171210P435E*8 | 30.6 | 3500 K | 80 | 4240 | 4559 | 34 | 900 | 149 |
CL25171210P440E*8 | 30.6 | 4000 K | 80 | 4297 | 4621 | 34 | 900 | 151 |
CL25171210P450E*8 | 30.6 | 5000 K | 80 | 4326 | 4651 | 34 | 900 | 152 |
CL25171210P457E*8 | 30.6 | 5700 K | 80 | 4354 | 4681 | 34 | 900 | 153 |
CL25171210P465E*8 | 30.6 | 6500 K | 80 | 4326 | 4651 | 34 | 900 | 152 |
CL25171210P422E*9 | 30.6 | 2200 K | 90 | 3187 | 3427 | 34 | 900 | 112 |
CL25171210P427E*9 | 30.6 | 2700 K | 90 | 3415 | 3672 | 34 | 900 | 120 |
CL25171210P430E*9 | 30.6 | 3000 K | 90 | 3586 | 3856 | 34 | 900 | 126 |
CL25171210P435E*9 | 30.6 | 3500 K | 90 | 3643 | 3917 | 34 | 900 | 128 |
CL25171210P440E*9 | 30.6 | 4000 K | 90 | 3671 | 3947 | 34 | 900 | 129 |
CL25171210P450E*9 | 30.6 | 5000 K | 90 | 3700 | 3978 | 34 | 900 | 130 |
CL25171210P457E*9 | 30.6 | 5700 K | 90 | 3728 | 4008 | 34 | 900 | 131 |
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
Nominal CCT |
Center Point | MAJOR AXIS (a , b) |
Ellipse
Rotation Angel,θ |
|||
X | Y | 2-Step | 3-Step | 5-Step | ||
2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
Notes for Table 39:
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL