Power: | 5W | Chip Material: | Bridgelux |
---|---|---|---|
Type: | COB LED | Application: | COB LED Grow Lamp |
Product Name: | COB LED | Lifespan: | 50000hours |
Highlight: | cob led chip,led light chips |
15W Bridgleux CL COB High Efficacy LM80 LED COB CHIP LEDs Indoor Light COB 160lm/w
• Efficacy of 155 lm/W typical for 3000K, 80CRI
• Compact high flux density light source
• Uniform, high quality illumination
• Minimum 70, 80, and 90 CRI options
• StreaCLined thermal path
• ENERGY STAR® / ANSI compliant color binning
structure with 2, 3 and 5 SDCM standard
• More energy efficient than incandescent, halogen
and fluorescent lamps
• High voltage or Low voltage DC operation
• Product series and company logo on the front
• RoHS compliant
The part number designation for TYF ML Series LED arrays is explained as follows:
Part Number |
Typical Power (W) | Nominal CCT (K) |
CRI |
Minimum Pulsed Flux (lm) | Typical Pulsed Flux (lm) | Typical Voltage (V) | Nominal Current (mA) | Typical Efficacy (lm/W) |
CL25171205P430E*7 | 15.3 | 3000 K | 70 | 2348 | 2525 | 34 | 450 | 165 |
CL25171205P435E*7 | 15.3 | 3500 K | 70 | 2376 | 2555 | 34 | 450 | 167 |
CL25171205P440E*7 | 15.3 | 4000 K | 70 | 2419 | 2601 | 34 | 450 | 170 |
CL25171205P450E*7 | 15.3 | 5000 K | 70 | 2447 | 2632 | 34 | 450 | 172 |
CL25171205P4*7E*7 | 15.3 | 5700 K | 70 | 2462 | 2647 | 34 | 450 | 173 |
CL25171205P465E*7 | 15.3 | 6500 K | 70 | 2447 | 2632 | 34 | 450 | 172 |
CL25171205P422E*8 | 15.3 | 2200 K | 80 | 1964 | 2111 | 34 | 450 | 138 |
CL25171205P427E*8 | 15.3 | 2700 K | 80 | 2106 | 2264 | 34 | 450 | 148 |
CL25171205P430E*8 | 15.3 | 3000 K | 80 | 2191 | 2356 | 34 | 450 | 154 |
CL25171205P435E*8 | 15.3 | 3500 K | 80 | 2220 | 2387 | 34 | 450 | 156 |
CL25171205P440E*8 | 15.3 | 4000 K | 80 | 2248 | 2417 | 34 | 450 | 158 |
CL25171205P450E*8 | 15.3 | 5000 K | 80 | 2277 | 2448 | 34 | 450 | 160 |
CL25171205P457E*8 | 15.3 | 5700 K | 80 | 2291 | 2462 | 34 | 450 | 161 |
CL25171205P465E*8 | 15.3 | 6500 K | 80 | 2277 | 2448 | 34 | 450 | 160 |
CL25171205P422E*9 | 15.3 | 2200 K | 90 | 1707 | 1836 | 34 | 450 | 120 |
CL25171205P427E*9 | 15.3 | 2700 K | 90 | 1821 | 1958 | 34 | 450 | 128 |
CL25171205P430E*9 | 15.3 | 3000 K | 90 | 1892 | 2035 | 34 | 450 | 133 |
CL25171205P435E*9 | 15.3 | 3500 K | 90 | 1935 | 2081 | 34 | 450 | 136 |
CL25171205P440E*9 | 15.3 | 4000 K | 90 | 1964 | 2111 | 34 | 450 | 138 |
CL25171205P450E*9 | 15.3 | 5000 K | 90 | 1978 | 2127 | 34 | 450 | 139 |
CL25171205P457E*9 | 15.3 | 5700 K | 90 | 1992 | 2142 | 34 | 450 | 140 |
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
Nominal CCT |
Center Point | MAJOR AXIS (a , b) |
Ellipse
Rotation Angel,θ |
|||
X | Y | 2-Step | 3-Step | 5-Step | ||
2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
6, Absolute Maximum Ratings
6.1 Table 39: Maximum Ratings
Notes for Table 39:
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL
Product Packing and Labeling