Item Type: | Grow Lights | CRI (Ra>): | 80 |
---|---|---|---|
Color: | Pink | Lifespan: | 50000 Hours |
Led Chip Brand: | Bridgelux | Name: | Horticulture Lightning Cob |
Certification: | CE, RoHS, CE/RoSH | ||
Highlight: | Horticulture Cob Led Chip,High Efficiency Horticulture Cob,Horticulture Led Cob Chip |
High efficiency horticulture lightning cob led grow light chip dimmable timer 100w led grow light diy
1, Features
• Efficacy of >130 lm/W typical for 6000K, 70CRI(PB)
• Efficacy of 140 lm/W typical for 6000K, 70CRI(P6)
• Copper base, thermal conductivity is 122-176W/(m·K) • Emitting diameter against 80kg pressure
• Minimum 70, 80 CRI options
• RoHS compliant
2 Advantages
2, Product Nomenclature
The part number designation for TYF Outdoor (OD) Series LED arrays is explained as follows:
3, Maximum Ratings
ITEM NO. | P(W) | CCT(K) | CRI | MIN (lm) |
MAX (lm) |
VOLTAGE(V) | CURRENT(mA) | (lm/W) |
HF40251006PB | 30 | 3000 K | 70 | 3186 | 3540 | 29.8 | 960 | 118 |
HF40251006PB | 30 | 3500 K | 70 | 3267 | 3630 | 29.8 | 960 | 121 |
HF40251006PB | 30 | 4000 K | 70 | 3321 | 3690 | 29.8 | 960 | 123 |
HF40251006PB | 30 | 5000 K | 70 | 3375 | 3750 | 29.8 | 960 | 125 |
HF40251006PB | 30 | 5700 K | 70 | 3429 | 3810 | 29.8 | 960 | 127 |
HF40251006PB | 30 | 6500 K | 70 | 3375 | 3750 | 29.8 | 960 | 125 |
HF40251006PB | 30 | 3000 K | 80 | 2916 | 3240 | 29.8 | 960 | 108 |
HF40251006PB | 30 | 3500 K | 80 | 2997 | 3330 | 29.8 | 960 | 111 |
HF40251006PB | 30 | 4000 K | 80 | 3051 | 3390 | 29.8 | 960 | 113 |
HF40251006PB | 30 | 5000 K | 80 | 3105 | 3450 | 29.8 | 960 | 115 |
HF40251006PB | 30 | 5700 K | 80 | 3159 | 3510 | 29.8 | 960 | 117 |
HF40251006PB | 30 | 6500 K | 80 | 3105 | 3450 | 29.8 | 960 | 115 |
HF40251010PB | 50 | 3000 K | 70 | 5220 | 5800 | 29.8 | 1600 | 116 |
HF40251010PB | 50 | 3500 K | 70 | 5355 | 5950 | 29.8 | 1600 | 119 |
HF40251010PB | 50 | 4000 K | 70 | 5445 | 6050 | 29.8 | 1600 | 121 |
4, Applications:
5. Optical properties
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
Nominal CCT |
Center Point | MAJOR AXIS (a , b) |
Ellipse
Rotation Angel,θ |
|||
X | Y | 2-Step | 3-Step | 5-Step | ||
2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
6, Absolute Maximum Ratings
6.1 Table 39: Maximum Ratings
Parameter | Value |
---|---|
Maximun Raing | N/A (missing value) |
LED Junction Termperature (T) | 125°C |
Stanga Tornponature | 35-12°C |
Operating Temperature | 20°C to +105°C |
Soldering Temperature | 35010-55°C |
EleotrostatioDischarge (HEM) | 2000V |
Single chip (Per parallet) | |
Limit Value | Masinun Dre Cument 200mA |
MADR | N/A (missing value) |
MexingFeakPuisedDricars | edargon oniushiql untapery |
HE Stig Sting Lishate Lisenting | Stight ping paring parian All All AL |
Notes for Table 12:
7, Mechanical Dimension
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
8, CAUTION
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL
9,Packaging and Labeling
Product Packing and Labeling