Certification: | RoHS | Type: | COB LED |
---|---|---|---|
Emitting Color: | Warm White/Natural White/Pure White/Cool White/Cold White | Application: | LED Grow Light |
Lifespan: | 50000 Hours | Product Name: | 10W 30W 50W 100W Full Spectrum High Power RGB COB Led Grow Light Chip |
Highlight: | Warm White High Power Cob LED,130lm/W High Power Cob LED,ANSI LED Grow Light Chip |
Warm White 100w Led Chip , LED Grow Light Led Chip Bridgelux Full Spectrum
• Efficacy of 130lm/W typical for 3000K, 80CRI
• Compact high flux density light source
• Uniform, high quality illumination
• Minimum 70, 80, and 90 CRI options
• StreaCLined thermal path
• ENERGY STAR® / ANSI compliant color binning structure with 2, 3 and 5 SDCM standard
• More energy efficient than incandescent, halogen and fluorescent lamps
• High voltage or Low voltage DC operation
• Product series and company logo on the front
• RoHS compliant
The part number designation for TYF ML Series LED arrays is explained as follows:
ITEM NO. | P(W) | CCT(K) | CRI | MIN (lm) |
MAX (lm) |
VOLTAGE(V) | CURRENT(mA) | (lm/W) |
HF40251006PB | 30 | 3000 K | 70 | 3186 | 3540 | 29.8 | 960 | 118 |
HF40251006PB | 30 | 3500 K | 70 | 3267 | 3630 | 29.8 | 960 | 121 |
HF40251006PB | 30 | 4000 K | 70 | 3321 | 3690 | 29.8 | 960 | 123 |
HF40251006PB | 30 | 5000 K | 70 | 3375 | 3750 | 29.8 | 960 | 125 |
HF40251006PB | 30 | 5700 K | 70 | 3429 | 3810 | 29.8 | 960 | 127 |
HF40251006PB | 30 | 6500 K | 70 | 3375 | 3750 | 29.8 | 960 | 125 |
HF40251006PB | 30 | 3000 K | 80 | 2916 | 3240 | 29.8 | 960 | 108 |
HF40251006PB | 30 | 3500 K | 80 | 2997 | 3330 | 29.8 | 960 | 111 |
HF40251006PB | 30 | 4000 K | 80 | 3051 | 3390 | 29.8 | 960 | 113 |
HF40251006PB | 30 | 5000 K | 80 | 3105 | 3450 | 29.8 | 960 | 115 |
HF40251006PB | 30 | 5700 K | 80 | 3159 | 3510 | 29.8 | 960 | 117 |
HF40251006PB | 30 | 6500 K | 80 | 3105 | 3450 | 29.8 | 960 | 115 |
HF40251010PB | 50 | 3000 K | 70 | 5220 | 5800 | 29.8 | 1600 | 116 |
HF40251010PB | 50 | 3500 K | 70 | 5355 | 5950 | 29.8 | 1600 | 119 |
HF40251010PB | 50 | 4000 K | 70 | 5445 | 6050 | 29.8 | 1600 | 121 |
HF40251010PB | 50 | 5000 K | 70 | 5535 | 6150 | 29.8 | 1600 | 123 |
HF40251010PB | 50 | 5700 K | 70 | 5625 | 6250 | 29.8 | 1600 | 125 |
HF40251010PB | 50 | 6500 K | 70 | 5535 | 6150 | 29.8 | 1600 | 123 |
HF40251010PB | 50 | 3000 K | 80 | 4770 | 5300 | 29.8 | 1600 | 106 |
HF40251010PB | 50 | 3500 K | 80 | 4905 | 5450 | 29.8 | 1600 | 109 |
HF40251010PB | 50 | 4000 K | 80 | 4995 | 5550 | 29.8 | 1600 | 111 |
HF40251010PB | 50 | 5000 K | 80 | 5085 | 5650 | 29.8 | 1600 | 113 |
HF40251010PB | 50 | 5700 K | 80 | 5175 | 5750 | 29.8 | 1600 | 115 |
HF40251010PB | 50 | 6500 K | 80 | 5085 | 5650 | 29.8 | 1600 | 113 |
5.1 Color Binning Information
Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)
CIE1931-x
Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range
Nominal CCT |
Center Point | MAJOR AXIS (a , b) |
Ellipse
Rotation Angel,θ |
|||
X | Y | 2-Step | 3-Step | 5-Step | ||
2200K | 0.5018 | 0.4153 | (0.0048 , 0.0027) | (0.0072, 0.0041) | (0.0120, 0.0067) | 39.9 |
2500K | 0.4806 | 0.4141 | (0.0050, 0.0027) | (0.0076, 0.0041) | (0.0126, 0.0068) | 53.1 |
2700K | 0.4575 | 0.4101 | (0.0053, 0.0027) | (0.0080, 0.0041) | (0.0133, 0.0068) | 54.1 |
3000K | 0.4338 | 0.4030 | (0.0057, 0.0028) | (0.0086, 0.0042) | (0.0142, 0.0069) | 53.7 |
3500K | 0.4073 | 0.3917 | (0.0062, 0.0028) | (0.0093, 0.0041) | (0.0155, 0.0069) | 54.0 |
4000K | 0.3818 | 0.3797 | (0.0063, 0.0027) | (0.0093, 0.0042) | (0.0157, 0.0068) | 53.4 |
5000K | 0.3447 | 0.3553 | (0.0054, 0.0024) | (0.0081, 0.0035) | (0.0135, 0.0059) | 59.8 |
5700K | 0.3290 | 0.3417 | (0.0048, 0.0021) | (0.0072, 0.0032) | (0.0119, 0.0052) | 58.8 |
6500K | 0.3123 | 0.3282 | (0.0044, 0.0018) | (0.0066, 0.0027) | (0.0110, 0.0045) | 58.1 |
6.1 Table 39: Maximum Ratings
Notes for Table 39:
Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode
8
RECOMMENDED SOLDERING CONDITION
For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a
temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied
to resin part while soldering is implemented. Next process of soldering should be carried out after the product has
return to ambient temperature. CAUTION: TEMPERATURE CONTROL
Product Packing and Labeling