Electronic Development Printed Circuit Board Assembly High Density SMT Designs

Basic Information
Place of Origin: CHINA
Brand Name: TYF
Certification: CE UL CB
Model Number: PCBA
Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: carton
Delivery Time: 10 workdays
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 100000 PCS/MONTH
Detail Information
Brand: TYF Copper Thickness: 0.3-3oz
Base Material: FR4, Aluminum, FPC Surface Finishing: HASL, OSP, Lead Free
Services: One-stop Services Max Board Size: 760mm*600mm
Layer: 1-26layers Certificate:: ISO9001/IATF16949/ISO13485
High Light:

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Product Description

Custom pcb factory pcba Design electronic development pcb design and assembly Electronic PCBA manufacturing


1. Details:

Item name: SMT Assembly PCBA PCBA 

Place of Origin: ShenZhen, China


MOQ: 1000 piece


2. PCB Design & Layout

» Excellent Expertise in design tools: Allegro, Pads, and Mentor Expedition.
» High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
» Flex PCB designs of all sorts
» Complete assembly drawings
» In-Circuit Test data generation (ICT)
» Drill, panel and cutout drawings designed
» Professional fabrication documents created
» High-speed, multi-layer digital PCB designs- Bus routing, differential pairs, matched lengths; Fast PCB design in 2-3 days.
» Concentrate on the PCB design Wi-Fi Module, BLE Module, GPS Tracking application.RF Modules,Medical-Care devices,LED PCB Boards.
» We come up with the design as per customer requirement,and take care for the RAW material cost at the outset of design.
» Full control for the PCB design, from requirement, Schematic, PCB Layout, SI/PI/EMI inspection, we will locate the design issues in the inspection processing.


3. PCB Specifications
PCB layer 1, 2, 4 or 6, up to 18 layers
Board shape Rectangular, round, slots, cutouts, complex, irregular
Board type Rigid, flexible, rigid-flexible
Board material FR-4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc.
Board cutting Shear, V-score, tab-routed
Board thickness 0.2 ~ 4.0 mm (±10%), Flex board: 0.01 ~ 0.25″ (±10%)
Copper weight 1.0, 1.5, 2.0 Oz (tolerance ±0.25 oz)
Solder mask Double-sided green LPI, Also support red, white, yellow, blue, black
Silk screen Double-sided or single-sided in white,yellow, black, or negative
Silk screen min. line width 0.006″ or 0.15mm
Max board dimension 20 inch *20 inch or 500mm*500mm
Min. trace/gap 0.10mm, or 4 mils
Min. drill hole diameter 0.01”, 0.25mm, or 10 mils
Surface finish HASL, Nickle, Imm Gold, Imm Tin, Imm Silver, OSP etc.
Min.slot width 0.12”, 3.0 mm, or 120 mils
V-score depth 20-25% of board thickness
Plated through holes Yes
Design file format Gerber RS274X, 274D, Eagle and AutoCAD’s, DXF, DWG, Protel 99se



4. PCB Assembly Center
Electronic Development Printed Circuit Board Assembly High Density SMT Designs 0
Supported Assembly Capabilities
Different types of Assembly
THD (Thru-Hole Device)
SMT (Surface-Mount Technology)
SMT & THD combined
2-sided SMT and THD assembly
Order Volume Allowed
1 to 5,000 boards

Passives parts, smallest size 0201
Fine pitch to 8 Mils
BGA, uBGA, QFN, POP and Zero-Lead chips
Connectors and terminals
Component Package
Cut tape
Tube and tray
Loose parts and bulk
PCB Board Measurements
Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
Largest dimension: 15″ x 20″ (381mm x 508mm)
Printed circuit board shapes
Slots and Cut outs
Complicated and Uncommon

PCB board kinds
Rigid FR-4 boards
Rigid-Flex boards
Assy procedures
Leaded process
ero-Lead (RoHS)
Design file formatting
Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
BOM (Bill of Materials) (.xls, .csv, . xlsx)
Centroid (Pick-N-Place Or XY file)
Testing Processes
Visual Inspection
X-ray Inspection
AOI (Also known as: Automated Optical Inspection)
ICT (AKA: In-Circuit Test)
Functional testing
Turnaround time periods
1 To 5 days for only printed circuit board assy
10 To16 days for full Turnkey Circuit Card Assy
5. Packaging


TYF Opto. LED modules products, packed in plastic Tray, according to different size, XX PCs each plastic Tray, as shown in the following. products without plastic box packed in bubble bags, in order to prevent the outside pressure, choose different bubble bag, according to the product size in each pack of XX products, packaged product will be stored in the form of carton and sealed, as shown in the following.


1) xx PCS LED module per Tray 4) Box information & packing

2)Tray stack and taping, XX LED module

trays and additional 1 dummy trays each up of

box. Add silica gel (1 each) on top of the tray

3) Sealing packing

Electronic Development Printed Circuit Board Assembly High Density SMT Designs 1


Contact Details

Phone Number : +8613717051823