Products
  • 产品名称: MF2517OB
  • 1: 15-20W
  • 2: 3000/4000/6000K 80Ra
  • 3: 120-130LM/W

Flip-Chip design, no gold wire encapsulating technology
Superior Thermal Conductive Aluminum Substrate, thermal conductivity is 122W/M*K
80Ra, highest can make >95Ra which can present the real color of CoB
Super thin phosphor film technology

 

Item

Symbol

Value

Unit

Max Pow er

P

10-20(Standard 15W)

W

DC Forw ard Current

IF

320

mA

Reverse Voltage

VR

-75

V

Junc tion Temperature

Tj

130

Operating Temperature

TOP R

-30~+60

Storage Temperature

TSTG

-35~+100

Thermal Resistanc e

RθJ-B

0.22

℃/W

Elec trostatic Limit

ESD

2000

V

Soldering Temperature

 

350℃/3-5S

 

 

 

Flip-Chip design, no gold wire encapsulating technology
Superior Thermal Conductive Aluminum Substrate, thermal conductivity is 122W/M*K
80Ra, highest can make >95Ra which can present the real color of CoB
Super thin phosphor film technology

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