Products
  • 产品名称: MF2514LG
  • 1: 30-45W
  • 2: 3000/4000/6000K 80Ra
  • 3: 110-120LM/W

Flip-Chip design, no gold wire encapsulating technology
Superior Thermal Conductive Aluminum Substrate, thermal conductivity is 122W/M*K
80Ra, highest can make >95Ra which can present the real color of CoB
Super thin phosphor film technology
 

 

Item

Symbol

Value

Unit

Max Power

P

30-45(Standard 35W)

W

DC Forward Current

IF

700-1400

mA

Reverse Voltage

VR

-60

V

Junction Temperature

Tj

130

Operating Temperature

TOPR

-30~+60

Storage Temperature

TSTG

-35~+100

Thermal Resistance

RθJ-B

0.58

℃/W

Electrostatic  Limit

ESD

2000

V

Soldering Temperature

 

350℃/3-5S

 

 

Parameter

Symbol

Condition

CRI

Min.

Typ.

Max.

Lm/W

Unit

Forward
Voltage

VF

IF=700mA  /Ta=25 ℃
IF=960mA  /Ta=25 ℃

/

36

39

40.8

/

V

IF=1400mA /Ta=25 ℃

Luminous Flux

Φv

CCT:6000K 700mA

90

2700

2850

3000

>90

Lm
(Lm/W)

80

3300

3450

3600

>110

CCT:6000K 960mA

90

3150

3325

3500

>90

80

3850

4025

4200

>110

CCT:6000K 1400mA

90

4050

4275

4500

>90

80

4950

5175

5400

>110

CCT:4000K 700mA

90

2700

2850

3000

>90

80

3300

3450

3600

>110

CCT:4000K 960mA

90

3450

3475

3500

>90

80

3850

4025

4200

>110

CCT:4000K 1400mA

90

4050

4275

4500

>90

80

4950

5175

5400

>110

CCT:3000K 700mA

90

2400

2550

2700

>80

80

3000

3150

3300

>100

CCT:3000K 960mA

90

2800

2975

3150

>80

80

3500

3675

3850

>100

CCT:3000K 1400mA

90

3600

3825

4050

>80

80

4500

4725

4950

>100

Flip-Chip design, no gold wire encapsulating technology
Superior Thermal Conductive Aluminum Substrate, thermal conductivity is 122W/M*K
80Ra, highest can make >95Ra which can present the real color of CoB
Super thin phosphor film technology
 

 

 

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